As the semiconductor world excitingly explores the potential of new advanced package solutions for their intricate and novel designs, challenges arise from undetected defects caused by the complexity ...

At-speed testing and delay defect analysis have become increasingly critical in ensuring the reliability and performance of modern integrated circuits. As circuit complexity grows alongside rapid ...

Read more about meeting the individual challenges of digital zero-defect testing and details of approaches to dealing with these challenges. The effectiveness of semiconductor manufacturing test has a ...

A newly drafted IEEE standard will bring more consistency to defect metrics in analog/mixed (AMS) designs, a long-overdue step that has become too difficult to ignore in the costly heterogeneous ...

With every process node advance, new types of manufacturing defects manifest. These defects are especially prevalent during the early phase. For early adopters, silicon manufacturing tests must evolve ...